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Printed Circuit Boards (PCBs) form the backbone of all major electronics. These miraculous inventions pop up in nearly all computational electronics, including simpler devices like digital clocks, calculators etc. For the uninitiated, a PCB routes electrical signals through electronics, which satisfies the device's electrical and mechanical circuit requirements. .Webgax provides PCB which help businesses increase customer satisfaction and engagement.Through PCB, we intend to assist clients in building innovative products to capture the market in a better manner.

Printing the Inner layers
PCB manufacturing prepares to make actual PCB. The basic form of PCB comprises a laminate board whose core material is epoxy resin and glass fiber that are also called substrate material. Laminate serves as an ideal body for receiving the copper that structures the PCB. Substrate material provides a sturdy and dust-resistant starting point for the PCB. Copper is pre-bonded on both sides. The process involves whittling away the copper to reveal the design from the films.
Removing the Unwanted Copper
With the photo resist removed and the hardened resist covering the copper we wish to keep, the board proceeds to the next stage: unwanted copper removal. Just as the alkaline solution removed the resist, a more powerful chemical preparation eats away the excess copper. The copper solvent solution bath removes all of the exposed copper. Meanwhile, the desired copper remains fully protected beneath the hardened layer of photo resist.
Layer Alignment and Optical Inspection
With all the layers clean and ready, the layers require alignment punches to ensure they all line up. The registration holes align the inner layers to the outer ones. The technician places the layers into a machine called the optical punch, which permits an exact correspondence so the registration holes are accurately punched.
Layer-up and Bond
All the separate layers await their union. With the layers ready and confirmed, they simply need to fuse together. Outer layers must join with the substrate. The process happens in two steps: layer-up and bonding. The outer layer material consists of sheets of fiber glass, pre-impregnated with epoxy resin. The shorthand for this is called prepreg. A thin copper foil also covers the top and bottom of the original substrate, which contains the copper trace etchings. Now, it's time to sandwich them together.

Your dream idea is about to
become real now!

We are all set with our r&d team to provide your idea a standard begining towards reality.

R&D
Infrastructre

We have an excellent infrastructure for product research and development where we can shape your idea into a real life product.

Innovative Accomplishments

We have an excellent past record of innovative accomplishments and we have satisfied many companies with this product development service.

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Quassarian Innovations Pvt. Ltd.